LEADERG AOI-3 for Die Bond - LEADERG Cloud-based Automated Optical Inspection (AOI) System

Are you looking for a high-speed, high-accuracy Automated Optical Inspection (AOI) System for post die bonding inspection?    

Are you already frustrated with human misjudgment, inspection inefficiency, low yield rate, and low customer satisfaction currently on your production lines?

Relief has arrived--look no further than LEADERG Cloud-based AOI System - LEADERG AOI-3! :)

LEADERG AOI-3 for Die Bond 實照.png

Mission of This Production Stage:

The die bonding process is where individual dies are attached to lead frames (L/F), the metal structure within the chip package, either with the use of epoxy glue or the eutectic bonding technique under certain temperature. 

LEADERG AOI-3 for Die Bond can perform highly efficient and effective visual inspection, screening exterior defects prior to wire bonding process, while offering accurate yield rate analyses. 

In the Past, You Only Have These Options:

1.  Screening with Human Visual Inspection (Aided by a Magnifying Glass):

-  Limited human reliability in die and wafer inspection, while causing severe eye strain in operators

-  Highly variable in quality of each shipment, subject to individual operators' own judgment

-  High underkill rate, adding to growing customer dissatisfaction

-  Labor intensive and inefficient, with steep administrative and managerial cost

2.  Screening with Other AOI Systems on the Market: 

-  Steep financial and time cost of imported machine purchases and maintainence

-  Limited after-sales service and support; lack of flexibility in adjusting to immediate production changes

-  Uncertain and unstable results, when trying to meet your company's requirement of inspection speed and accuracy

LEADERG Cloud-based AOI System - 

LEADERG AOI-3 for Die Bond 

LEADERG AOI-3 for Die Bond-1.jpg

Our Competitive Advantages:

1.  A Customized, End-to-end Product Design to Suit Local Needs: 

  • Localized, Customized, and Immediate Service:  Our locally based teams of engineers can quickly cutomize, modify, and test our AOI systems to suit your production lines' special needs.  No waiting necessary!

  • End-to-end System Design:  We are specialized in cost-efficient software/hardware integrated design.  With locally sourced high-quality hardware parts and update-on-demand software design, we can meet our clients' every needs with most cost-efficient solutions.

2. Detail-Oriented, Affordable Local Price Range Hardware Design with Imported Grade High Quality:

  • Stainless Steel-Plated, State-of-the-Art Chassis:  Our attention to every hardware design detail helps to extend our product's service life and reduce maintenance cost.

  • "Six-at-Once" Simultaneous Multi-Angle Camera Shot:  Combining an agile robotic arm with six cameras covering six different angles, our unique "six-at-once" multi-angle filming allows our clients to inspect individual die from above, below, the front, the back, the left, and the right of it, reducing inspection and response time.

3. Two Exclusive Technologies to Exceed Our Clients' Expectations:

  • Exclusive Cloud Computing Technology:  Our highly effective algorithms and cloud computing design will yield immediate improvement in the underkill and overkill rate of your product inspection, exceeding industry standard by far!

  • Exclusive Big Data Analysis Technology:  Our AOI System is capable of real-time analysis of product yield rate, helping our clients to quickly discover the crux of the problem on their production lines!

Accurate, high-speed, high price-performance ratio!

Most cost-efficient AOI System, but with optimal results!

Choose LEADERG and let your products LEAD the market!

LEADERG Cloud-based AOI Architecture-1.png

(LEADERG Cloud-based AOI System, Cloud Computing Architecture)

Inspection Items:

Topside Chipping
Backside Chipping
Chip Crack
Die Tilt
Chip Lifted
Die Orientation
Die Rotation
Epoxy on Chip
Die Scratch
Chip Position
INK Chip
Without D/A
L/F Foreign Material
L/F Deformation
Epoxy on Lead
Epoxy Coverage around Chip
Epoxy on Finger
Finger Foreign Material Residue
Foreign Material on Chip
Gold Finger Discolor
Foreign Material on Ball Pad
Substrate Scratch
Epoxy Overflow (LOC)

Allow us to design optimal-quality, satisfaction-guaranteed AOI solutions for your production lines with best results in mind!

Further Reading

1.
LEADERG AOI-1 for Final Visual - LEADERG Cloud-based Automated Optical Inspection (AOI) System

2.
AOI (Automated Optical Inspection) Projects

Thanks for the support from our clients

National Taiwan University, National Tsing Hua University, National Yang Ming Chiao Tung University, National Cheng Kung University, Taipei Medical University, Kaohsiung Medical University, National Taipei University of Nursing and Health Sciences, China Medical University, National Chung Hsing University, National Central University, National Sun Yat-sen University, National Chung Cheng University, National Chi Nan University, National Chiayi University, National Ilan University, National Taipei University of Education, National United University, Tamkang University, Feng Chia University, Chang Gung University, I-Shou University, Shih Chien University, Tatung University, Chung Yuan Christian University, Soochow University, Tzu Chi University, Tzu Chi University of Science and Technology, National Taiwan University of Science and Technology, National Taipei University of Technology, National Taichung University of Science and Technology, National Yunlin University of Science and Technology, National Chin-Yi University of Technology, National Formosa University, National Pingtung University of Science and Technology, National Kaohsiung University of Science and Technology, Chaoyang University of Technology, Ming Chi University of Technology, Minghsin University of Science and Technology, Southern Taiwan University of Science and Technology, Asia Eastern University of Science and Technology, China University of Technology, National Taiwan Sport University, National Defense University, Republic of China Naval Academy, Republic of China Army Academy, Luodong Senior High School, Gushan Senior High School, Kaohsiung Girls Senior High School, National Taiwan University Hospital, National Cheng Kung University Hospital, Taipei Veterans General Hospital, Chang Gung Memorial Hospital, Tzu Chi Hospital, E-Da Hospital, Far Eastern Memorial Hospital, Lien Hsin International Hospital, National Chung-Shan Institute of Science and Technology, Armaments Bureau, Ministry of National Defense, Ministry of Justice Investigation Bureau, Industrial Technology Research Institute, Institute for Information Industry, Institute of Nuclear Energy Research, Atomic Energy Council, Endemic Species Research Institute, Council of Agriculture, Institute of Labor, Occupational Safety and Health, Ministry of Labor, Taiwan Textile Research Institute, Metal Industries Research & Development Centre, Taiwan Instrument Research Institute, Automotive Research & Testing Center, Chunghwa Telecom, Taiwan Water Corporation, Taiwan Semiconductor Manufacturing Company, United Microelectronics Corporation, Nanya Technology Corporation, Winbond Electronics Corporation, Wafer Works Corporation, Grandtop Optoelectronics, AU Optronics, Innolux Corporation, HannStar Display Corporation, Formosa Plastics Corporation, Formosa Petrochemical Corporation, Formosa Technologies Corporation, Nan Ya Plastics Corporation, Formosa Chemicals & Fibre Corporation, CPC Corporation, Taiwan, Logitech, Elan Microelectronics Corporation, Lextar Electronics Corporation, Darfon Electronics Corporation, Sercomm Corporation, EZconn Corporation, Foxconn Technology Group, WPG Holdings, World Peace Industrial Co., Ltd., Mirle Automation Corporation, Shuttle Machinery Co., Ltd., ChipMOS Technologies Inc., Simplo Technology Co., Ltd., Primax Electronics Ltd., Intesys Technology, Feng Hsin Iron & Steel Co., Ltd., China Ecotek Corporation, Zhu Sheng Technology, Advantech Co., Ltd., Stark Technology Inc., Hong Teng Technology, MiTAC International Corp., SYNNEX Technology International Corp., Allion Labs, Inc., Co-in International, Feng An Auto, Hong Hu International, Blue Ocean Intelligence, TOPPAN IDGATE Co., LTd., Far EasTone Telecommunications, SYSTEX Corporation, Cooler Master, Lion Travel, Beigang Wude Temple, Xiluo Fuxing Temple, etc.